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 <p style=";font-size: 14px;font-family: DengXian;text-align: center;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">CCF</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">走进高校第</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">942</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">场</span></p><p style=";font-size: 14px;font-family: DengXian;text-align: center;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体">敬请关注</span></p><p style="font-size: 14px; font-family: DengXian; white-space: normal; line-height: 21px;"><span style="font-size: 15px;line-height: 22px;font-family: 宋体"><br/></span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif"> </span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体">由中国计算机学会（</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">CCF</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">）主办，</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">CCF</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">容错计算专委、浙江大学承办的</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">CCF</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">走进高校活动，将于</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">2023</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">年</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">4</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">月</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">23</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">日在浙江大学召开，敬请关注。</span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体"><br/></span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif"> </span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体">时间：</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">2023</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">年</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">4</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">月</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">23</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">日（周日）</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">13:00--17:00</span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体">活动地点：浙江省杭州市萧山区建设三路</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">733</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">号杭州科创中心启动区块</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">9</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">号楼</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">9356-2</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">会议室</span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif"> </span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体"><br/></span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体">报告信息：</span></p><p style="margin: 0 0 8px;font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体">报告题目：硬件安全原语设计</span></p><p style="margin: 0 0 8px;font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体">报告摘要：中国作为世界集成电路需求最大的市场，芯片自给率却不足四成，中兴和华为事件更是痛击我国芯片产业的短板。安全芯片是众多芯片中至关重要的一类，不仅为信息系统提供安全处理功能，也为</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">CPU</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">GPU</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">等芯片的安全运行提供有效保障，可从根本上提升系统的安全性。硬件安全原语（</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">PUF</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">TRNG</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">等）是安全芯片设计的核心组件，但其电路设计面临安全性、可靠性，吞吐量低等难题。本报告将分享硬件安全原语</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">PUF</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">和</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">TRNG</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">面临的挑战以及团队在</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">DAC2022</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">和</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">DAC2023</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">的两个相关工作：一种双态物理不可克隆电路和一种超高吞吐量与高能效真随机数发生器。</span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif;color: rgb(51, 51, 51)"> </span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体">嘉宾简介：</span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif"></span></p><p style="text-align: left;"><img src="https://www.ccf.org.cn/upload/resources/image/2023/03/16/0ddbf9fe6c27921b5e467e3ee09bb15e_500x500.jpg" title="clip_image002" alt="clip_image002" suffix="jpg" style="max-width: 100%; width: 129px; height: 155px;" width="129" height="155"/></p><p style="margin: 0 0 8px;font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体">张吉良，国家优青，湖南大学教授、半导体学院（集成电路学院）副院长。主持国家自然科学基金重点项目、国防科技基础加强计划重点项目等。主要从事集成电路设计、集成电路硬件安全、后摩尔时代新型计算架构等方向研究，以一作</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">/</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">通信作者发表学术论文</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">60</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">余篇，其中</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">CCF A</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">类会议和</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">ACM/IEEE</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">期刊</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">35</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">篇。</span></p><p style="margin: 0 0 8px;font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体"><br/></span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif"> </span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体">报告题目：近似计算电路</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">及</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">应用</span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体">报告摘要：</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">后摩尔时代的集成电路面临日益严重的功耗挑战，需要寻求新的计算范式来同时满足高性能和低功耗的要求。近似计算作为</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">提高</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">芯片能效</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">的有效</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">方法得到了工业界和学术界的广泛关注。本报告从近似计算的思想开始，首先介绍近似计算</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">单元，特别是近似乘法器及关键</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">DSP</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">单元的设计、然后介绍面向</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">人工智能、通信和格密码等</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">可容错应用的近似电路和算法协同设计等，最后讨论近似计算</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">的</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">未来研究方向。</span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif"> </span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体">嘉宾简介：</span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif"></span></p><p style="text-align: left;"><img src="https://www.ccf.org.cn/upload/resources/image/2023/04/21/8f097f2c53d824d6d98168ab8d3cf05c_500x500.jpg" title="刘伟强" alt="刘伟强" suffix="jpg" style="max-width: 100%; width: 176px; height: 181px;" width="176" height="181"/></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体">刘伟强，现任南京航空航天大学集成电路学院</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">专职</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">副院长、教授、博士生导师。</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">“</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">空天集成电路与微系统</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">”</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">工业和信息化部重点实验室主任、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">IEEE</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">纳米技术委员会（</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">NTC</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">）当选副主席（</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">VP-Elect, 2022-2023</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">）、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">IEEE TVLSI</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">期刊指导委员会主席（</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">SC Chair, 2023-2024</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">）、</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">国家优青。主要研究高能效高安全性新兴计算</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">芯片</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">。担任工信部商用密码应用推进专家委员会委员，</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">Proceedings of the IEEE</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">客座编委，以及</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">IEEE TC</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">TCAS-I</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">TET</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">C</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">等芯片设计领域国际</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">权威</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">期刊编委，出版英文专著</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">2</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">部，发表</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">IEEE</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">及</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">ACM</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">汇刊</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">论文</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">80</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">余篇（特邀论文</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">9</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">篇），授权发明专利</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">20</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">余</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">件</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">。获</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">江苏省科学技术奖一等奖（排</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">1</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">）、</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">第</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">18</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">届霍英东教育基金会青年科学奖、</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">国防技术发明二等奖（排</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">4</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">）、华为技术成果转化奖</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">等科技奖励。</span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体"><br/></span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif"> </span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体">报告题目：同态加密软硬件协同设计</span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体">报告摘要：全同态加密是一种可以在不传输解密密钥的前提下在密文上执行任意（图灵完备）计算的密码算法，在外包计算及双方安全计算场景中有广泛应用。尽管全同态加密具有最优交互轮数及低在线通信量的特点，但密文计算效率很低，阻碍了全同态加密在许多数据安全保护领域的应用落地。本次报告将以全加密处理器及全加密数据库等场景为例，介绍课题组在全同态加密的应用设计、算子设计、算法实现及硬件加速等多个方面的研究成果。</span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif"> </span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体">嘉宾简介：</span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体"></span></p><p style="text-align: left;"><img src="https://www.ccf.org.cn/upload/resources/image/2023/03/24/33d29f1cb1f0f1eed32b8a5bb4c58f58_500x500.jpg" title="边松" alt="边松" suffix="jpg" style="max-width: 100%; width: 147px; height: 171px;" width="147" height="171"/></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif"> </span></p><p style="margin: 0 0 8px;font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体">边松，中国计算机学会容错专委执行委员，</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">CCF</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">会员，于</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">2014</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">年毕业于威斯康辛麦迪逊分校，分别于</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">2017</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">年和</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">2019</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">年在京都大学取得硕士与博士学位，于</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">2019</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">年任京都大学助理教授，于</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">2021</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">年任北京航空航天大学网络空间安全学院副教授。他的主要研究方向是同态加密、隐私保护计算与密码软硬件协同加速，于</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">USENIX Security</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">TIFS</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">VLDB</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">及</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">DAC</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">等</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">CCF-A</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">类期刊及会议发表论文</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">14</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">篇，其中以第一或通讯作者身份发表论文</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">9</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">篇。获国家自然基金委、日本文部科学省战略创造研究、日本学术振兴会特别研究员项目支持。他是多个国际会议与期刊的程序委员与审稿人，包括</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">AAAI</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">ICML</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">IEEE TDSC</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">TIFS</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">及</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">TCAD</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">。</span></p><p style="margin: 0 0 8px;font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体"><br/></span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif"> </span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif"> </span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体">报告题目：高速轻量化异构量子密钥分发系统</span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体">报告摘要：近年来，量子信息科技因其广阔的应用前景引起了学术界和工业界的广泛关注。</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">QKD </span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">应用的广泛部署将需要低</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif"> SWaP</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">（即尺寸、重量和功率）</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">QKD</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">硬件系统，高能效异构量子信息处理电路与系统是推广</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">QKD</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">应用的关键技术。</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">QKD</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">后处理系统在离散变量</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif"> (DV) </span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">或连续变量</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif"> (CV) QKD </span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">协议的安全密钥高速生成中发挥着重要作用。围绕高效量子信息处理应用的定制化硬件加速器的研究日益增长，研究人员开始应用光链路</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">-CPU-GPU-FPGA</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">异构集成技术研发软硬件协同的</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">QKD</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">加速系统。因此，本次报告讨论异构</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">QKD</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">系统的原理和技术，重点围绕</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">QKD</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">后处理包括量子密钥筛选、密钥、保密增强等算法，综合对比用于</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">QKD</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">后处理的代表性硬件平台特点，最后本次将展示本人参与搭建的高速轻量化量子密钥分发系统。</span></p><p style="margin: 0 0 8px;font-size: 14px;font-family: DengXian;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif"> </span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体">嘉宾简介：</span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif"></span></p><p style="text-align: left;"><img src="https://www.ccf.org.cn/upload/resources/image/2023/03/16/6c708bbefffbbdf7fd_500x500.jpg" title="clip_image008" alt="clip_image008" suffix="jpg" style="max-width: 100%; width: 115px; height: 169px;" width="115" height="169"/></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体">李鹤，中国计算机学会容错专委执行委员，博士毕业于英国帝国理工学院，先后在英国剑桥大学（师从剑桥大学副校长、英国皇家工程院院士）担任量子信息处理方向博士后研究员和三一学院教学讲师，东南大学电子科学与工程学院副研究员，入选</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">“</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">中国科协青年人才托举工程</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">“</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">（青托）。李鹤博士在可编程芯片（</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">FPGA</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">）开发和系统优化、量子计算电路与系统、量子通信系统和集成电路硬件安全等领域取得一些独创性成果，在</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">IEEE TC</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">TCAD</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">TVLSI</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">TCAS-II</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">MICRO</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif"> DAC </span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">OFC</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">等领域重要期刊会议上发表论文</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">40</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">余篇，授权</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">/</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">受理发明专利若干项，获得</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">IEEE FPT 2017 </span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">**论文展示奖。目前担任可编程芯片（</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">FPGA</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">）</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif"> </span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">和集成电路</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">EDA </span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">领域国际旗舰会议技术程序委员会（</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">TPC</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">）委员，如</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">DAC</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">ICCAD</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">ICCD</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">ISCAS</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif"> FCCM</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">FPL</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">FPT </span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">等、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">Frontiers in Electronics </span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">期刊编委</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">, Electronics</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">期刊和电子信息学报专题副主编，</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">IEEE FPT 2020-2022 </span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">共同宣传主席，</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">IEEE/ACM FCCM</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">ASAP</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">GLSVLSI</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">ASPDAC</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">SOCC</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">CCF CHIP</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">等分会议主席，</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">IEEE Young Professions </span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">工作委员会委员以及十余个</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">ACM/IEEE </span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">汇刊审稿人。</span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体"><br/></span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif"> </span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体">报告题目：大芯片互联集成方法</span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体">报告摘要：近芯粒（</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">Chiplet</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">）设计技术被认为是后摩尔时代继续提高算力密度的重要技术之一，其近年来在芯片设计，特别是大算力处理器方面表现出重要作用。计算所和之江实验室布局基于芯粒的大芯片设计方法，目标在几百平方毫米甚至晶圆级尺度上完成高密度的设计与集成。本次报告主要介绍项目团队在互联与集成方面的工作。</span></p><p style="margin: 0 0 8px;font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif"> </span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: 宋体">嘉宾简介：</span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif"></span></p><p style="text-align: left;"><img src="https://www.ccf.org.cn/upload/resources/image/2023/04/21/297ad7bb860e9aa64f76779eb_500x500.jpg" title="王郁杰" alt="王郁杰" suffix="jpg" style="max-width: 100%; width: 182px; height: 174px;" width="182" height="174"/></p><p style=";font-size: medium;font-family: 宋体;white-space: normal;line-height: 24px"><span style="font-size: 15px;line-height: 22px">王郁杰，中科院计算所副研究员，之江实验室研究专家。在南开大学获学士学位，南开大学</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">-</span><span style="font-size: 15px;line-height: 22px">得州农工大学联合培养博士，</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">2017</span><span style="font-size: 15px;line-height: 22px">年加入中科院计算所任职，</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">2021</span><span style="font-size: 15px;line-height: 22px">年加入之江实验室。目前从事</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">Chiplet</span><span style="font-size: 15px;line-height: 22px">等分离制设计方法的计算核设计、互连系统设计、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">EDA</span><span style="font-size: 15px;line-height: 22px">设计等工作。作为任务负责人完成多款处理器芯片设计和流片工作，其工作成果作为主要交付物完成了重大科技项目交付验收。主持国家自然科学基金项目、之江实验室科研攻关项目子课题等。在</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif"> DAC</span><span style="font-size: 15px;line-height: 22px">、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">ICCAD</span><span style="font-size: 15px;line-height: 22px">、</span><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">TVLSI </span><span style="font-size: 15px;line-height: 22px">等集成电路会议、期刊上发表多篇论文。</span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif"> </span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif"><br/></span></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif"></span></p><p style="text-align: left;"><img src="https://www.ccf.org.cn/upload/resources/image/2023/04/13/8457b1a3eacbb81ea5bad48_500x500.png" title="clip_image011" alt="clip_image011" suffix="png" style="max-width: 100%; width: 181px; height: 167px;" width="181" height="167"/></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif"></span><br/></p><p style=";font-size: 14px;font-family: DengXian;text-align: justify;white-space: normal;line-height: 21px"><span style="font-size: 15px;line-height: 22px;font-family: &#39;Times New Roman&#39;, serif">CCF</span><span style="font-size: 15px;line-height: 22px;font-family: 宋体">微信公众号，欢迎关注</span></p><p><br/></p>